Electrical and Computer Engineering
3D IC paper at ASPLOS 2006 selected among the 10 most significant research publications of the year in Computer Architecture by IEEE Micro.
ICCAD 2006 Tutorial with Highlights Power and Thermal Challenges for 65nm and Below (Download Slides)
Directions in Carbon Nanotube Research – Article in ACM-SIGDA E-Newsletter
UCSB-Intel Researchers Propose Cool Solutions for Hot Chips
IC Cooling paper highlighted at IEDM
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Applied Physics Letters
IEEE Electron Device Letters
IEEE Instrumentation & Measurement Magazine
IEEE Journal of Solid-State Circuits
IEEE Transactions on Circuits and Systems I. Fundamental Theory and Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part B, Advanced Packaging
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Electron Devices
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Nanotechnology
IEEE Transactions on Reliability
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
International Journal of Analog Integrated Circuits and Signal Processing
Journal of Applied Physics
Microelectronics Journal
Nature
Nanotechnology
Nano Letters
Physical Review Letters
Proceedings of the IEEE
Science
Semiconductor Science and Technology
EE Times
IEEE Circuits and Devices Magazine
IEEE Design and Test of Computers
IEEE Spectrum
Physics Today
Scientific American
Software Tools:
HSPICE:Circuit Simulation MEDICI and TSUPREM: Device Simulation ANSYS: Finite Element Analysis Other Tools:All Software supported by ECE
HSPICE:Circuit Simulation
MEDICI and TSUPREM: Device Simulation
ANSYS: Finite Element Analysis
Other Tools:All Software supported by ECE
How To:
Setup Environment for remote session
Setup a New ECE email Account
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