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High
Frequency Electronics Group |
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With appropriate advances
in materials, design, and fabrication processes, III-V transistors can reach cutoff
frequencies of at least 2-3 THz. Such transistors will
enable future generations of ICs for wireless communications and imaging
systems operating at even far-infrared
(0.3-3 THz) frequencies. |
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We seek to explore the
limits of high frequency circuits, exploiting both our own research THz
transistor processes and fast nm CMOS
VLSI processes. We seek to extend the
frequency range of RF-ICs well into the far-infrared. We seek to develop high power amplifiers
and phased arrays, so as to enable radio systems of useful capacity and range
at mm-wave and higher frequencies. We seek to exploit the high bandwidth of
modern IC processes to support high-rate optical communications. |
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As gate lengths approach 16
nm and oxide equivalent thicknesses drop below 1 nm, continued scaling of transistors
in VLSI becomes progressively more difficult. We seek to develop high-current
and low-operating-voltage transistors for scaling generations beyond 16
nm. |
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