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University of California, Santa Barbara
Department of Electrical and Computer Engineering

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Semiconductor Device Processing

ECE 120A – Winter 2019

Instructor: Dr. Ilan Ben-Yaacov

Schedule: Mon/Wed 9:30-10:45am, Bldg 387 Room 1011

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Announcements

* 2/26/19: HW5 is posted on the class website.

* 2/12/19: HW4 is posted on the class website.

* 1/28/19: HW3 is posted on the class website.

* 1/20/19: HW2 is posted on the class website.

* 1/7/19: Make-up lecture will be held on Friday 1/25 from 9:30-10:45am in PHELPS 1437.

* 1/6/19: Welcome to ECE 120A!  HW1 and all handouts are posted on the class website.

 

Syllabus (click here for syllabus in .pdf format)

Time:                       Mon/Wed 9:30–10:45am

Place:                      Bldg 387 Room 1011

Instructor:               Dr. Ilan Ben-Yaacov, HFH Room 5111, ext 5295, ilan@ece.ucsb.edu

Office Hours:          Mon/Wed 11:00–11:50am in HFH 5111

 

Teaching Assistants:          Suraj Dhanak (dhanak@umail.ucsb.edu), lab hours Tues/Thurs/Fri 2-4pm.

                                                Xiaowen Guo (xguo@umail.ucsb.edu), lab hours Wed 2-5pm and Fri 9am-12pm.

 

Lab Supervisor:          Bob Hill, Engineering II Room 1141, ext 4142, bob@ece.ucsb.edu

 

Laboratory Hours:      There are no scheduled hours for the lab work.  The UCSB Instructional Cleanroom will be available weekdays from 8am-5pm.  For safety reasons, you will not be permitted to work alone.  There will be equipment demonstration sessions, which are required.

 

Lab Safety:         It is essential that safety procedures be followed at all times.  You will be working with acids (including HF), bases, and organic solvents that can be hazardous if not handled properly.  You are required to attend a safety orientation session before you will be permitted to enter the lab.  There are sessions provided by the university, or a series of tapes provided by the ECE department and Bob Hill.

 

Required Text:  Fundamentals of Semiconductor Fabrication by G. S. May and S. M. Sze, published by John Wiley and Sons, 2004, ISBN 0-471-23279-3.

 

Handouts and class notes will complement the text.  All handouts can be downloaded by clicking on the appropriate link at the bottom of this website.

 

Prerequisites: ECE 132 with a grade of C- or better, or equivalent, or consent of the instructor.

 

 

Topics to be covered:

* Optical Lithography

* Thermal Oxidation

* Junction Formation

* Etching

* Thin Film Deposition

* Ohmic, Schottky, and MOS Contact Formation

* NMOS Process and Characterization

 

 

Course Format:     There will be homework assignments, a midterm, laboratory work, and a final lab project. Laboratory work will consist of experimenting with various processes such as lithography, thermal oxidation, and wet etching, and determining process tolerances.  For the final project, you will use the skills you have developed in the lab to fabricate and characterize a MOS transistor.  Homework, midterm, lab, and final lab project will each contribute 15%, 30%, 15% and 40% to the final grade.

 

 

Lab Projects

Lab Project 1 – Due Tues, 1/22/19 by 5:00pm 

Lab Project 2 – Due Tues, 2/5/19 by 5:00pm

Final Lab PreLab – Due Tues, 2/19/19 by 5:00pm

Final Lab Project – Due Tuesday, 3/19/19 by 11:59pm

 

Homework Assignments – turn into box on 3rd floor of HFH

Homework 1Due Thurs, 1/17/19 by 5:00pm    

 

Homework 2Due Tues, 1/29/19 by 5:00pm     

 

Homework 3Due Tues, 2/12/19 by 5:00pm     

 

Homework 4Due Tues, 2/26/19 by 5:00pm     

 

Homework 5Due Wed, 3/6/19 by 5:00pm   

 

 

Homework Solutions (requires password)

 

Midterm

Midterm will be on Monday, 3/11/19.  You will be allowed a calculator and 3 pages of notes (8.5 by 11 inch, you may write on front and back).  Midterm review will be in class on Wednesday 3/6/19.

 

 

Lab Procedures                              Handouts

NMOS Process                                                                 Solid Solubilities of Impurities in Silicon

Wafer Scribing and Cleaning                                           Periodic Table of Elements

HF Safety Tips                                                                  Lateral Diffusion

Lithography Process                                                         Slides

Descum Process

Furnace Cleanliness

Oxidation Procedure

Phosphorous Predeposition

Metal Lift-Off Process

Metal Evaporation – Thermal Evaporator

 

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