Tsung-Ching (Jim) Huang, Technical Staff Member, TSMC Design Center
In the first part of my talk, I will present a flexible insole pedometer with piezoelectric energy harvester that appeared in ISSCC 2012. Flexible electronics feature themselves by excellent mechanical flexibility and ultra-thin form factor (<0.1mm in thickness). However, the printed electronic circuits can have large process variations and suffer from time-dependent degradations due to exposure to bias-stress or oxygen in the ambient air. I will present circuit design solutions to meet these challenges of flexible electronics. In the second part of my talk, I will present a silicon optical bench (SiOB) and 28Gb/s shared-inductor CMOS optical receiver in 28nm CMOS for the next-generation optical network-on-the-chip. Optical interconnect recently emerges as a promising candidate to meet the rapid increasing bandwidth requirements of the high-speed I/O. The cost and the electrical-optical integration, however, remain to be the bottleneck for wide adoption of optical interconnects. The proposed receiver, appeared in ISSCC 2014, achieves the state-of-the-art energy efficiency while reducing the chip area by 56% compared with conventional inductive-peaking. Finally, I will discuss my future research directions for designing energy-aware smart devices in a more connected world.
About Tsung-Ching (Jim) Huang:
Tsung-Ching (Jim) Huang is currently a member of the technical staff at TSMC Design Center, San Jose. He received his M.S. and Ph.D. in ECE from University of California, Santa Barbara in 2006 and 2009, and his B.S. in EE from National Chiao-Tung University, Taiwan in 2001. After receiving his Ph.D., he worked as a research associate and subsequently an adjunct assistant professor at The University of Tokyo, Japan. His primary research interests include high-speed CMOS mixed-signal circuits and sub-threshold CMOS circuits, as well as reliability analysis, CAD, and circuit design for flexible wearable electronics and displays. Dr. Huang received Best Paper Awards from International Symp. on Flexible Electronics and Displays (ISFED) and IEEE International Electron Devices Meeting (IEDM) for his research in flexible electronics. His work has been highlighted in IEEE Solid-State Circuit Magazine and EE Times. Since 2011, he has been leading research projects on next-generation optical network-on-the-chip at TSMC. Dr. Huang has 12 US patents filed/issued, and has authored/co-authored more than 25 technical publications in the fields of solid-state circuit, electron devices, display, CAD, and material science, and has given a number of invited talks for his research.
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