"Long-Wavelength WDM Vertical-Cavity Surface-Emitting Laser Arrays Spanning 140 nm," J. Geske, D. Leonard, M. MacDoughal, Y. L. Okuno, J. Pipker, J. E. Bowers, Proceedings of 29th European Conference on Optical Communication (ECOCī03), Rimini, Italy, SEPTEMBER 2003

"Dual-Wavelength Vertical-Cavity Surface-Emitting Laser Arrays Fabricated by Nonplanar Wafer Bonding," J. Geske, Y. L. Okuno, D. Leonard, J. E. Bowers, Conference Digest of the 18th IEEE International Semiconductor Laser Conference, (ISLCī02), Garmisch, Germany, SEPTEMBER 2002

"Vertical and Lateral Heterogeneous Integration Using Direct Wafer Bonding," J. Geske, V. Jayaraman, Y. L. Okuno, J. E. Bowers, International Conference on Compound Semiconductors, Tokyo, Japan, OCTOBER 2001

"Vertical and Lateral Heterogeneous Integration," J. Geske, V. Jayaraman, Y. L. Okuno, J. E. Bowers, Conference Proceedings of IEEE/LEOS 14th Annual Meeting (LEOS 2001), vol. 2, pp. 881-882, San Diego, CA, SEPTEMBER 2001

"Vertical and lateral heterogeneous integration," J. Geske, V. Jayaraman, Y. L. Okuno, J. E. Bowers, Applied Physics Letters, vol. 79, no. 12, pp. 1760-1762, SEPTEMBER 2001