May 26 (Fri) @ 11:40am: "Near-field Data Transmission for Biomedical Implants," Sohmyung Ha, Ass't. Prof., NYU Abu Dhabi

Date and Time
Engineering Science Building (ESB), Rm 2001


Inductive links have been widely used for simultaneous wireless power and data transmission for various biomedical implants. In this tutorial, basic principles of inductive coupling, wireless power transmission, and backscattering will be first reviewed. Then, recent techniques to enhance the data rate, power transfer efficiency, power consumption and robustness in the inductive power and data transmission will be discussed. In addition, practical design considerations in the context of biomedical applications will be covered.


Professor Sohmyung Ha received the B.S. (summa cum laude) and the M.S. degrees in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2004 and 2006, respectively. From 2006 to 2010, he worked at Samsung Electronics as a mixed-signal circuit designer for commercial multimedia devices. After this extended career in industry, he returned to academia as a Fulbright Scholar and obtained the M.S. and Ph.D. degrees in Bioengineering with the Engelson Best Ph.D. Thesis Award for Biomedical Engineering from the Department of Bioengineering, University of California, San Diego, La Jolla, CA, USA, in 2015 and 2016, respectively. Since 2016, he has been an Assistant Professor at New York University Abu Dhabi, Abu Dhabi, UAE, and a Global Network Assistant Professor at New York University, New York, NY, USA.

He currently serves as an associate editor of IEEE Transactions on Biomedical Circuits and Systems and Frontiers in Electronics and served as an associate editor of Smart Health (Elsevier) from 2016 to 2021. He is a member of the Analog Signal Processing Technical Committee (ASP TC) and the Biomedical and Life Science Circuits and Systems Technical Committee (BioCAS TC) of the IEEE Circuits and Systems Society (CASS). He is also a member of the IMMD Subcommittee of the International Technical Program Committee (ITPC) of the International Solid-State Circuits Conference (ISSCC).

Hosted by: Professor Bongjin Kim

Submitted by: Bongjin Kim <>