ECE Seminar Series – Oct 10 (Fri) @ 2:00 PM: "Co-Packaged Optical Transceivers for HPC, Data Center, and AI Applications," Daniel M. Kuchta, Principal Hardware System Architect, NVIDIA

Location: Engineering Science Building (ESB), Room 1001
Come at 1:30p for Cookies, Coffee and Conversation
DISTINGUISHED LECTURE at the ECE SEMINAR SERIES

Abstract

This talk will cover the status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.

Bio

Daniel M. Kuchta  (IEEE Fellow 2019)  is a Principal Hardware System Architect at Nvidia. Previously he was a Research Staff Member in the Communications and Computation Subsystems Department at the IBM Thomas J. Watson Research Center since 1992. He received B.S., M.S., and Ph.D. degrees in Electrical Engineering and Computer Science from the University of California at Berkeley in 1986, 1988, and 1992, respectively. While at IBM Research he worked on high-speed VCSEL characterization, multimode fiber links, and parallel fiber optic link research. He received IEEE Journal of Lightwave Technology best paper award in 2014 and in 2018 was the first recipient of the IEEE Photonics Technology Letters best paper award.  He was Technical Program Chair for OFC 2018 and General Chair for OFC 2020. Dr. Kuchta is an author/coauthor of more than 145 technical papers and inventor/co-inventor of at least 40 patents.

Hosted by: Professor Clint Schow

Submitted by: Aaron Wissing <aaronwissing@ucsb.edu>