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Nov 7 (Fri) @ 2:00pm: "Advancement in Packaging for Silicon Photonics-CMOS Electronics Copackaged Optics," Zachary Nelson, ECE PhD Defense

Date and Time

Location: Henley Hall (HH), Room 1010
Zoom Meeting: https://ucsb.zoom.us/j/87208559556?pwd=j1L0nrQCSfFhC6h0dA60TNICUrsDT3.1
Research Area: Electronics & Photonics
Research Keywords: Circuit Design, Biomedical Imaging

Abstract

Co-Packaging Photonics with CMOS components is a promising strategy for forming higher bandwidth interlinks while maintaining a low energy cost per bit of information transmitted. These systems are in high demand as an interconnect solution in datacenters and high volume compute environments. Hybridization allows for customization of individual subcomponents to ideal process nodes for their individual roles in the system. Because this family of package architectures demands complicated connections in package between the different subcomponents, new packaging techniques and processes are required.

The techniques outlined in this work demonstrate a low temperature post processing technique for producing redistribution lines while maintaining reasonable amounts of planarity between layers to allow for scalability to further metal layers and compatibility for die embedding techniques. The process was designed with yield as a major design goal to create a set of design rules to allow future packages to be created with minimal requirements on components. Variations of these techniques were implemented on subpackages with the goal to test the integration between the CMOS and Photonics components, which are composed of an embedded die to bring CMOS die to wafer level processing and redistribution lines fabricated on the wafer above the die, to demonstrate the feasibility of this packaging process for future packages.

Bio

Zachary Nelson received his B.S. degree in Electrical and Computer Engineering from University of California, Davis in 2020 and a M.S. degree in Electrical and Computer Engineering from University of California, Santa Barbara in 2022. Currently he is pursuing a Ph.D. in Electrical and Computer Engineering at University of California Santa Barbara, with a focus on CMOS-Photonics Co-Packaging for optical interconnects.

Hosted By: ECE Prof. & Chair, Luke Theogarajan

Submitted By: Zachary Nelson <zlnelson@ucsb.edu>